Two-year agreement reflects growing pressure on advanced packaging and testing capacity from AI chip demand
Two-year agreement reflects growing pressure on advanced packaging and testing capacity from AI chip demand
Chip wet process equipment provider teams up with Germany's Singulus to build end-to-end PLP capabilities
Chip wet process equipment provider teams up with Germany's Singulus to build end-to-end PLP capabilities
AMD partnership signals Taiwan’s deepening role in AI platform ecosystem
AMD partnership signals Taiwan’s deepening role in AI platform ecosystem
Chipmaker adds packaging in US, potentially skipping finishing process in Taiwan
Chipmaker adds packaging in US, potentially skipping finishing process in Taiwan
Wu outlines 3 challenges semiconductor industry will face with AI rise
Wu outlines 3 challenges semiconductor industry will face with AI rise
Powertech mulling high-end chip packaging plant in Japan
Powertech mulling high-end chip packaging plant in Japan
Tech minister wants to focus on chip design
Tech minister wants to focus on chip design
Thousands of migrant workers ordered to halt duties, impacting production capacity
Thousands of migrant workers ordered to halt duties, impacting production capacity
