TAIPEI (Taiwan News) — Taiwan’s substrate and printed circuit board makers reported strong July sales as demand for AI servers and high-performance computing continued to grow, CTEE reported Monday.
Unimicron Technology Corp. and Kinsus Interconnect Technology Corp. extended their streaks of record monthly revenue, while Zhen Ding Technology Holding Corp. and Gold Circuit Electronics Ltd. also posted solid results. The companies are increasing capital spending and expanding production capacity to keep pace with rising orders.
PCBs provide the foundation for assembling electronic components. They are used in nearly all electronic products, with copper circuits embedded in the boards connecting different components and carrying electrical signals and power between them, according to Sinotrade.
Integrated circuit substrates are one of the three main types of PCBs. They sit between chips and PCBs, helping hold the chips in place and connect them to the rest of the circuit. Ajinomoto Build-up Film (ABF) and bismaleimide triazine (BT) substrates are the two main types.
Unimicron reported July revenue of NT$16.25 billion (US$504.5 million), up 9.11% from the previous month and 43.69% from the same period a year earlier. The figure marked a new monthly high for the fourth consecutive month.
The second phase of Unimicron’s Hukou plant in Hsinchu County is scheduled to begin production in the third quarter. Its second plant in the area is planned to start operations in the second quarter of next year.
Kinsus posted July revenue of NT$4.55 billion, up 7.69% from the previous month and 35.85% from a year earlier. The company set a new monthly record for the fifth consecutive month.
Kinsus had originally budgeted about NT$8 billion in capital spending for this year, including NT$6 billion to expand ABF substrate production and NT$2 billion for maintenance. It recently approved an additional NT$19.6 billion for expansion projects to increase capacity, according to UDN Money.
Zhen Ding’s July revenue rose 3.33% from the previous month and 31.82% from a year earlier to NT$17.6 billion, the highest monthly level so far this year. The company is accelerating construction of a second ABF plant operated by its subsidiary, Leading Interconnect Semiconductor Technology Co., in Shenzhen to prepare for AI-related orders expected between 2027 and 2029.
Gold Circuit posted July revenue of NT$10.02 billion, up 21.31% from the previous month and 77.38% from a year earlier. The figure exceeded NT$10 billion for the first time, driven by orders for PCBs used in AI servers.
Gold Circuit expects third-quarter performance to improve from the previous quarter, as some shipments were delayed until July and new capacity came online in Taiwan and Thailand. A newly leased plant in Taoyuan’s Yangmei District is scheduled to begin adding capacity in the third quarter.
Institutional investors expect the sector to receive support in the second half of the year from continued AI-related orders and higher prices for ABF and BT substrates. As server designs evolve, manufacturers are seeing greater requirements for PCBs with more layers, larger substrates, and more advanced materials.
Analysts said growth across the supply chain is being driven not only by higher shipment volumes but also by a shift toward higher-value products. They expect the market to remain firm next year, with manufacturers gaining clearer visibility into future orders.
