TAIPEI (Taiwan News) — Taiwan Institute of Economic Research researcher Liu Pei-chen (劉佩真) said Friday that a reported DRAM shortage could delay deliveries of advanced chips and packaging, but TSMC can respond by adjusting production lines.
Market reports said TSMC has been unable to complete packaging of processors worth about NT$32.3 billion (US$1 billion) produced for Apple because of tight DRAM supplies, leaving the chips at its facilities while awaiting memory components, per Liberty Times. The shortage reportedly involves memory needed for advanced packaging of processors, including chips expected to power Apple’s upcoming iPhone 18 Pro series.
The A20 Pro chip, which is expected to be manufactured using TSMC’s 2 nm process, has reportedly progressed smoothly through wafer production, per CNA. However, Liu explained that advanced processors must be integrated with high-bandwidth memory or DRAM through advanced packaging before shipment, meaning memory shortages could still affect delivery schedules.
Liu said TSMC’s business remains strong due to sustained demand for high-performance computing and flagship chips, CNA reported. However, he said the world’s largest contract chipmaker cannot completely avoid the impact of memory shortages, which could create challenges for advanced processes and packaging operations.
A shortage of memory components could delay inventory preparation for flagship products, disrupting production cycles and affecting capital efficiency, Liu said. He added that TSMC does not produce DRAM and cannot directly control memory supply, but it can respond through capacity adjustments and coordination with suppliers.
Liu said TSMC could shift some production capacity toward AI and high-performance computing chips, which are less affected by consumer electronics demand. Such adjustments would help the company manage supply chain disruptions while maintaining production, he said.
