TAIPEI (Taiwan News) — TSMC is expected to build three advanced packaging plants at Chiayi Science Park, National Science and Technology Council Minister Wu Cheng-wen (吳誠文) said.
Wu made the remarks at a groundbreaking ceremony on Sunday for the second phase of the park. The new phase is expected to attract industries related to AI, heterogeneous integration packaging, and quantum technology, with TSMC as a key participant, according to LTN and UDN Money.
The second phase is expected to be completed in 2031. Work on TSMC's packaging plant at the site began in June.
Two of TSMC's packaging plants in the park’s first phase are currently undergoing equipment installation. They are expected to begin mass production in 2027.
The chipmaker has maintained a leading position not only in advanced semiconductor manufacturing but also in advanced packaging technologies.
Its CoWoS (Chip-on-Wafer-on-Substrate) technology has become widely used in AI chips, driving TSMC to accelerate the expansion of its advanced packaging capacity. CoWoS is a 2.5D packaging technology that allows multiple chips to be combined into a single package, enabling AI chips to process more data while using less space and power, according to Business Weekly.
Beyond CoWoS, TSMC is also developing next-generation packaging technologies such as CoPoS. The technology is in the equipment and materials validation stage this year, with pilot production and mass production planned for later phases, according to MoneyDJ.
TSMC is also exploring glass-core substrate solutions for future packaging technologies. Current development efforts are focused on validating processes, materials, and the flatness of large-sized substrates.
The first and second phases of Chiayi Science Park are expected to generate NT$313.2 billion (US$9.7 billion) in annual revenue and create 9,200 jobs. The park will also connect with the Southern Taiwan Science Park while linking northward to the Central Taiwan Science Park and Hsinchu Science Park.
