TAIPEI (Taiwan News) — Taiwan’s semiconductor supply chain is turning its attention to TGV (through glass via) technology as the industry searches for next-generation packaging solutions to support growing AI computing demand, CTEE reported.
As demand for higher computing performance pushes advanced packaging technologies beyond the limits of conventional materials, glass substrates have emerged as a potential next-generation solution. TGV is a key process in glass substrate development, involving the creation of microscopic vertical holes through glass layers to allow electrical signals to pass between different parts of advanced semiconductor packages, according to Sinotrade.
Domestic equipment makers, material suppliers, and process developers are leveraging their existing expertise to capture opportunities in the emerging TGV supply chain as major industry players accelerate glass substrate development for advanced packaging. With many companies targeting pilot production lines and yield testing by this year, suppliers of TGV-related equipment, including drilling, heat treatment, wet processing, and inspection systems, have already begun receiving orders.
E&R Engineering has developed laser modification technology for TGV manufacturing. Its US customers have completed equipment validation and received shipments.
The company has also secured orders for laser equipment used in later-stage glass substrate processing. Market analysts said E&R’s long-term cooperation with Intel, as the chipmaker expands advanced packaging capacity, could provide additional growth opportunities.
Group Up Industrial Co. has also expanded into TGV-related equipment used for glass substrates and fan-out panel-level packaging (FOPLP). The company has shipped equipment in small volumes to US customers and major semiconductor packaging and testing companies, gaining experience in glass interposer and glass carrier applications.
Analysts said Group Up’s order visibility extends into the first half of 2027. Further growth is expected as demand increases for higher-end semiconductor packaging solutions.
Meanwhile, inspection technology is becoming increasingly important in TGV manufacturing. Industry sources said that even a small number of defective holes could cause an entire glass panel to be scrapped, making defect detection a key factor in improving production yields. Utechzone Co., which specializes in automated optical inspection equipment, has been developing inspection solutions for defects in glass substrates and TGV holes.
Unimicron Technology Corp., one of the world’s leading integrated circuit substrate manufacturers, is also viewed as a potential participant in the future TGV supply chain. Because TGV-based packaging may share some manufacturing processes and customer qualification systems with existing advanced substrates, analysts believe Unimicron could benefit if glass substrate adoption accelerates.
However, TGV technology still faces major manufacturing hurdles before it can move toward large-scale production. Research presented at the IEEE Electronic Components and Technology Conference highlighted issues including crack control, hole consistency, limits on hole depth relative to width, and production yields.
Since glass is brittle, microscopic cracks and defects can form during drilling. As future AI packaging designs require larger substrates with potentially millions of holes, maintaining consistent quality and high yields will be critical.
Hole wall quality is another major concern, as rough surfaces can affect copper plating and signal performance. Current TGV manufacturing approaches include laser drilling, chemical etching, and hybrid methods that combine both techniques.
Laser drilling provides high precision, while chemical etching may offer advantages for mass production. A hybrid approach is being considered as a potential pathway toward improving scalability.
Cost is another barrier, as TGV-based glass core substrates remain more expensive than mature ABF substrates. Improving drilling speed, equipment capacity, and production yields will be necessary before TGV technology can move beyond pilot projects and toward wider commercial adoption.
