TAIPEI (Taiwan News) — Amkor and TSMC announced on Tuesday a 10-year cooperation agreement to expand advanced semiconductor packaging capabilities in the US.
Amkor said the agreement establishes a framework under which TSMC will procure advanced packaging and testing services from Amkor, per CNA. It added that the partnership aims to accelerate investment and capacity building in the US semiconductor ecosystem.
TSMC Senior Vice President of Global Business Chang Hsiao-chiang (張曉強) said the two companies have worked on advanced packaging for a long time. He said the new collaboration will further enhance their ability to serve customers.
Amkor CEO Kevin Engel said the agreement marks an important milestone in the companies’ partnership. He said it will also accelerate Amkor’s advanced manufacturing expansion in the US.
The announcement comes as Amkor expands its footprint in Arizona, where it has reportedly acquired an additional 27 hectares of land adjacent to an existing 42-hectare site, CNA reported. The company is developing a new facility there, with production expected to begin in 2028.
