TAIPEI (Taiwan News) — Foxconn on Thursday announced a strategic partnership with Intel to develop end-to-end AI solutions.
The companies said they will jointly explore AI offerings spanning chips, racks, systems, and applications, per CNA. The collaboration is aimed at accelerating the deployment of edge AI and physical AI technologies.
In AI infrastructure, Foxconn and Intel will work on rack-scale systems built around Intel Xeon processors and AI accelerators. The partnership will also focus on high-speed interconnects, thermal management, liquid cooling, system monitoring, and scalable AI data center architectures.
The two companies also plan to collaborate on next-generation edge AI and physical AI platforms. Target applications include agentic AI, robotics, smart manufacturing, smart cities, and automotive systems.
Beyond infrastructure, Foxconn said it will explore opportunities with Intel in custom ASIC design and system integration services, per Anue. The companies aim to combine Intel’s semiconductor capabilities with Foxconn’s manufacturing and design ecosystem to pursue new business opportunities worldwide.
Foxconn Chair Young Liu (劉揚偉) said AI is rapidly transforming industries and societies, creating demand for new computing infrastructure. Intel CEO Lip-Bu Tan said agentic AI workloads are reshaping computing requirements and require innovation across the entire technology stack, from chips to rack-scale systems.
