TAIPEI (Taiwan News) — Foxconn broke ground Monday on an advanced packaging and testing facility in France valued at NT$9 billion (US$286.22 million).
The project is led by Tessalia, a joint venture formed by Foxconn, defense and electronics firm Thales, and precision components maker Radiall, per CNA. The facility is located in Le Barp, about 40 minutes south of Bordeaux.
Production is expected to begin by the end of 2029, with annual output projected to exceed 50 million system-in-package components by 2033, per The Storm.
Foxconn S Business Group President Chen Wei-ming (陳偉銘) said the project represents more than a factory, calling it a strategic platform for strengthening Europe’s semiconductor ecosystem. He said it also reflects Foxconn’s broader long-term cooperation in France.
Chen said Thales brings aerospace and high-reliability system expertise, while Radiall contributes precision manufacturing and advanced connectivity capabilities. Foxconn provides global manufacturing scale and semiconductor packaging technology, he said.
French Industry Minister Sebastien Martin said technological sovereignty does not mean producing everything domestically, but building critical capacity without overreliance on external suppliers. He said the project supports France’s strategy in high-value niche semiconductor segments.
Martin said the facility will focus on components used in aerospace, space, and other strategic industries, rather than mass-market consumer electronics. He added that Foxconn’s participation brings industrial capabilities not previously deployed in Europe.
Radiall CEO Pierre Gattaz said the project will serve defense and healthcare, while Thales CEO Patrice Caine said it strengthens Europe’s autonomy and resilience in critical technologies.
