TAIPEI (Taiwan News) — UMC said Wednesday that its 12 nm partnership with Intel is progressing smoothly, with validation underway in Arizona and mass production expected to begin in 2027.
Speaking at the company’s annual shareholders’ meeting, UMC CEO Wang Shih (王石) said Intel has completed the process technology transfer for the joint 12 nm FinFET platform, per CNA. He said validation is being carried out at Intel’s Arizona facility as part of UMC’s broader US manufacturing strategy.
Wang said the validation process is expected to finish this year, paving the way for mass production in 2027. He described the collaboration as an important milestone in UMC’s overseas expansion and advanced process development.
UMC reported NT$237.6 billion (US$7.56 billion) in revenue last year, with a gross margin of 29% and net profit attributable to the parent company of NT$41.7 billion, per Tai Sounds. Earnings per share reached NT$3.34 despite weak consumer demand, geopolitical uncertainty, and currency volatility.
Wang said revenue from UMC’s 22 nm, 28 nm, and specialty process technologies hit record highs last year, while the third-phase expansion of its Singapore fab strengthened the company’s global production resilience. UMC also invested NT$17.7 billion in research and development focused on 5G, automotive electronics, and AI applications.
The company is also expanding into advanced packaging and next-generation connectivity technologies. Wang said UMC’s active interposer technology is undergoing customer validation, while its 2.5D packaging solution has begun shipments to major clients.





