TAIPEI (Taiwan News) — AMD will invest more than NT$315.58 billion (US$10 billion) in Taiwan’s industrial ecosystem to accelerate AI infrastructure development and expand advanced packaging capacity, the company announced on Wednesday.
The chip designer said the investment targets rising global demand for AI computing, deeper strategic partnerships, and next-generation system scaling, per CNA. AMD Chair and CEO Lisa Su said AI adoption is accelerating quickly, driving customers to expand infrastructure to meet surging computing needs.
AMD said it is combining its high-performance computing technologies with Taiwan’s semiconductor ecosystem and global partners to build integrated rack-scale AI systems. The aim is to help customers deploy next-generation AI infrastructure faster and more efficiently.
The company said it is leveraging strengths in chiplet architecture, high-bandwidth memory integration, 3D hybrid bonding, and rack-scale design to advance chip, packaging, and manufacturing technologies. AMD said this will improve performance, energy efficiency, and deployment speed for AI systems.
AMD is working with ASE Technology Holding, Siliconware Precision Industries, and other partners to develop and validate next-generation wafer-based 2.5D bridge interconnect technology. It said its EFB architecture can improve bandwidth and power efficiency, supporting the Venice CPU with higher performance per watt under real-world conditions.
The company said it has reached a milestone with Powertech Technology in validating 2.5D panel-level EFB interconnect technology, enabling larger-scale high-bandwidth interconnects and more cost-efficient AI systems. AMD added that these advances will support deployment of its Helios rack-scale platform in the second half of this year, with ODM partners including Sanmina, Wiwynn, Wistron, and Inventec involved in system development.
