TAIPEI (Taiwan News) — AI-driven demand is reshaping the global PCB materials industry, with Taiwanese suppliers expanding their role for next-generation AI servers, according to the Taiwan Printed Circuit Association.
A joint report with the Industrial Technology Research Institute forecast the global CCL market will exceed NT$674.89 billion (US$21.5 billion) this year, up 34.2% year-on-year, per CNA. The TPCA said strong demand for AI computing is driving a shift across the PCB supply chain, boosting prices and shipments of copper-clad laminates (CCLs).
TPCA said AI servers require large, high multilayer boards with ultra-low-loss characteristics, pushing the CCL market into what it described as a “golden growth period.” It said the global CCL market reached NT$502.67 billion last year and is expected to expand rapidly alongside AI infrastructure investment.
Taiwanese firms accounted for 37.4% of the global CCL market last year, with Elite Material Co. holding the world’s largest share at 18.9%, per Liberty Times. Suppliers are also developing next-generation materials such as Low Dk2 fiberglass cloth and quartz cloth.
Despite Taiwan’s gains, Japanese companies continue to dominate key semiconductor substrate materials used in advanced AI chip packaging. TPCA said Japanese supplier Ajinomoto controlled 97.1% of the global ABF substrate market last year, while Japanese firms also held over 70% of Bismaleimide-Triazine substrates and low thermal expansion fiberglass cloth.
The report said suppliers are increasingly prioritizing AI-related orders because demand is less price-sensitive, contributing to structural supply shortages. As AI servers shift toward Nvidia’s B300 and GB300 platforms, demand for higher-performance materials and components rises.
TPCA also highlighted growth in high-performance copper foil used in high-speed transmission. Global production capacity rose 48.1% in 2025 to 23,400 metric tons, while Taiwan-backed supplier Co-Tech secured a top-three global position with a 10.3% market share.
