TAIPEI (Taiwan News) — Hu Shih-min (胡世民), director of Hsinchu Science Park Bureau, said the National Science and Technology Council is set to review the expansion plan for Taoyuan’s Longtan Science Park on Monday.

The bureau will revise parts of the project based on the review results and submit the plan to the Cabinet for approval by July. Construction in the expansion area is expected to begin in the fourth quarter of 2029, per CNA.

Hu said TSMC is considering building an advanced fab in the science park and is assessing the site’s feasibility for chip production. The company operates an advanced packaging facility at the park, primarily focused on packaging chips for AI applications.

The company is reportedly planning an angstrom-scale semiconductor fab or a chip-on-panel-on-substrate packaging facility at the site. The angstrom node refers to next-generation process technology below 2 nm, which can be used in AI servers, high-end smartphones, and EV processors.

Hu noted the government will conduct an environmental impact assessment for the park’s expansion area. Once approved, the project will move on to land acquisition, as most of the area is privately owned.

TSMC had previously planned to build an advanced semiconductor fab at the park, but the project was suspended in 2023 due to opposition from residents. They objected to the government’s proposed expansion scope and land acquisition approach.

Hu said the government will improve water and electricity supply at the science park to meet the needs of Taiwan’s tech sector. Mayor Chang San-cheng (張善政) added the city government will continue working with the bureau to enhance infrastructure around the park.

Taipower Chair Tseng Wen-sheng (曾文生) said the company will strengthen power development and grid deployment to meet rising electricity demand. He estimated that electricity consumption will more than double over the next 10 years, driven by the rapid growth of AI and the semiconductor sectors.