TAIPEI (Taiwan News) — US-based Neo Semiconductor has partnered with National Yang Ming Chiao Tung University in Hsinchu to develop a new memory technology expected to overcome traditional limits on memory capacity and be used in AI devices.
The company said the memory uses a vertical design and can be used in high-bandwidth memory and high-performance computing devices. Compared with conventional memory that requires layer-by-layer stacking of DRAM chips, it said the new technology is closer to a single, unified 3D structure, per CNA.
The new memory can store and retrieve data in under 10 nanoseconds, the company noted. The memory also maintained stability at 85 C in tests conducted by the Taiwan Semiconductor Research Institute.
Company founder Andy Hsu (許富菖) said traditional memory is facing limits in capacitor technology and growing demand for higher data storage capacity. He said the new 3D X-DRAM memory uses a capacitor-free design, which increases data storage and allows greater vertical chip stacking.
The company plans to license the new technology to memory manufacturers in Taiwan for mass production and is in talks with some Taiwanese semiconductor companies.
The company has focused on next-generation memory and AI computing research and development. It holds more than 38 patents in the US. The firm mainly generates revenue by licensing its patents to semiconductor or memory manufacturers.
At a press conference on Thursday, Acer Group founder Stan Shih (施振榮) said he has funded Neo Semiconductor, hoping it will use the money to further advance memory technology. He also expects the company to work with Taiwan’s semiconductor sector to strengthen the country’s memory design capabilities.
