TAIPEI (Taiwan News) — Merck unveiled new photoresist and display materials technologies at Touch Taiwan this week, showcasing advances in chip packaging and next-generation displays.

This year focused on fan-out panel-level packaging and the expansion of Micro LED into optical communications, per CNA. Merck presented thick-film photoresist used in advanced packaging, alongside inspection and measurement solutions.

Merck Taiwan optoelectronics head Li Yung-li (李勇立) said the company supports industrial innovation. He added that strengthening Taiwan’s competitiveness and supply chain resilience remains a key goal.

As advanced packaging and heterogeneous integration become central to AI development, Merck said it is combining materials science with inspection technologies. These solutions target panel-level packaging, through-glass via processes, and high-precision inspection needs.

In panel-level packaging, Merck uses chemical amplified resist in redistribution layers to enable chip miniaturization. Its thick-film photoresist also helps form copper pillars, improving conductivity and heat dissipation.

Merck also showcased liquid crystal innovations aimed at higher performance and lower power consumption. These materials are designed to meet evolving demands for display quality and broader applications.

In automotive displays, Merck highlighted liquid crystal solutions using fringe field switching technology. The approach improves contrast and durability, supporting reliable performance under extreme conditions.