TAIPEI (Taiwan News) — Nan Pao Resins Chemical CEO Hsu Ming-hsien (許明現) said the company will expand production of advanced semiconductor packaging adhesive materials, with related product development progressing ahead of schedule.
To advance adhesive material development, Nan Pao partnered with Advanced Echem Materials and Trusval Technology to establish Shin Bao Hong Technology. Earlier this month, Shin Bao Hong acquired Tape Pro Co., a company with a full adhesive production line, to increase production capacity, per CNA.
Hsu said that Nan Pao has entered the semiconductor packaging UV-curable tape supply chain. The tape is suitable for laser cutting and chip dicing processes, offering high adhesion and residue-free performance, and applies to AI and high-performance computing chips, Hsu added.
The company’s footwear and industrial adhesive segments saw a decline in revenue due to weaker demand. To address this, Hsu said the company plans to collaborate with international footwear brands to develop new adhesive materials and secure more orders.
Earlier this month, Nan Pao received a NT$40 million (US$1.33 million) subsidy from the Ministry of Economic Affairs to help develop shoe soles made from recycled carbon fiber. The company said it uses heat to melt and reshape recycled plastic and carbon fiber into flexible soles.
Nan Pao is optimistic about the market for adhesives used in semiconductor packaging and other electronics industries. The company added that it is shifting its business focus to offset declining footwear and industrial adhesive orders, particularly in its North American export market.
Hsu noted the company’s construction materials revenue grew mainly due to its expansion in the Australian market. He added that its industrial coatings business will target government infrastructure, AI infrastructure, and consumer electronics sectors.
The company reported revenue of NT$23.2 billion last year, up 0.9% year-on-year. Net profit was NT$2.44 billion, benefiting from increased sales of adhesive materials for semiconductor packaging.
