TAIPEI (Taiwan News) — TSMC said its 2 nm process has entered mass production, extending its lead in the world’s most advanced semiconductor manufacturing.
The company said on its website that it began “volume production in Q4 2025 as planned.” Fab 22 in Kaohsiung will serve as the main production site, per Liberty Times. Generally, the smaller the process, the more advanced the chip.
According to the company, the 2 nm will offer the industry’s highest transistor density and energy efficiency, per CNA. The nanosheet architecture is designed to deliver improvements in performance and power efficiency.
Compared with its 3 nm N3E process, TSMC said the 2 nm node delivers 10% to 15% higher speed at the same power consumption, or cuts power use by 25% to 30% at the same speed. Chip density will also increase by more than 15%.
TSMC said it will roll out an enhanced N2P version of the process, with mass production planned for the second half of 2026, targeting smartphone and high-performance computing applications.
Rivals are also advancing next-generation nodes, with Samsung beginning mass production of its 2 nm gate-all-around chips and Intel preparing its comparable 18A process. However, TSMC said its 2 nm and derivative technologies will further widen its lead.
