TAIPEI (Taiwan News) — TSMC’s 2nm chip process has already booked full orders for 2026, with monthly production expected to reach 100,000 wafers as demand from major customers surges.

Research analyst Dan Nystedt said TSMC’s two 2nm fabs in Hsinchu and Kaohsiung are in the pilot production and validation phase, per Liberty Times. The yield rate is reportedly nearing 70%, which is notable because TSMC achieved similar milestones during trial production last year.

Industry estimates suggest the first batch of mass-produced 2nm wafers by year-end could reach 40,000 per month. As TSMC gradually ramps up its four fabs across Hsinchu, Kaohsiung, and other locations, total monthly capacity could reach nearly 100,000 wafers by the end of 2026.

Demand for TSMC’s advanced packaging is also increasing. Semiconductor equipment suppliers said that in addition to expanding CoWoS packaging used by Nvidia, Apple, and AMD are boosting demand for SoIC advanced packaging, potentially pushing total advanced packaging capacity beyond 150,000 wafers per month next year.

It is not yet known which customer placed the largest order, but UDN reported in September that Apple has secured over half of the initial 2nm capacity. This is seen as a move to gain an edge over companies such as Qualcomm and MediaTek.