TAIPEI (Taiwan News) — Taiwan’s Representative to Japan Lee Yi-yang (李逸洋) addressed a US government proposal to divide TSMC production “50-50” between Taiwan and the US while attending a welcome dinner for the Taiwan-Japan Semiconductor Alliance Seminar on Monday.
Lee said the proposal has prompted considerable discussion, but noted that TSMC’s US-based manufacturing processes remain roughly two and a half years behind those in Taiwan. He said Taiwan continues to hold clear technological advantages and core competencies, calling TSMC’s global footprint an “extension of national strength,” per CNA.
The seminar, held in Tokyo, is co-sponsored by Taiwan’s Indo-Pacific Strategic Think Tank and Japan’s Institute for National Fundamentals. Keynote speakers include former Japanese Defense Minister Kihara Minoru and former Taiwan Economic Affairs Minister Wang Mei-hua (王美花).
In his remarks, Lee also dismissed what he described as false rumors that “TSMC will become ASMC.” He said TSMC’s US operations are currently capable of mass-producing 4 nm and 3 nm chips, with 2 nm production not expected until late 2027 at the earliest.
By contrast, TSMC began mass production of 2 nm chips in Taiwan this year and plans to start producing 1.4 nm chips in 2028. Lee said the gap between Taiwan and TSMC's US facilities in advanced process technology remains about two and a half years.
Lee said TSMC’s R&D headquarters in Taiwan employs more than 8,000 researchers and remains the world’s largest semiconductor research center. In contrast, TSMC's US facilities primarily provide maintenance and production support, rather than advanced research.
He added that TSMC’s 1.4 nm production plans include four new fabs under construction in Taichung, two in Hsinchu, and one in Kaohsiung. This expansion, he said, highlights Taiwan’s continued leadership in semiconductor technology and ensures that core know-how remains secure.
According to Lee, the global semiconductor industry’s structure is complementary: the US leads in semiconductor design, the Netherlands’ ASML dominates in extreme ultraviolet lithography technology, and Japan controls about 30% of global semiconductor manufacturing equipment and 50% of materials.
Lee concluded that Taiwan is a key partner in the “democratic supply chain,” and TSMC’s overseas investments in the US, Japan, and Germany reflect its growing role in maintaining global chip stability.
