TAIPEI (Taiwan News) — TSMC is expected to break ground in October on a 1.4 nm fab, the first of four chip facilities in the Central Taiwan Science Park.

In June, TSMC acquired land for the second phase of the science park's expansion in Taichung, per Liberty Times. Local cement and construction companies have since begun receiving tender invitations for related projects.

Industry representatives who met with CTSP Director-General Hsu Maw-shin (許茂新) confirmed that TSMC has already obtained the permits needed to begin construction. Meanwhile, work on water and soil conservation facilities for the second phase, including water detention ponds, is expected to be completed by the end of September, clearing the way for groundbreaking in October.

The four new fabs are set to use more than one million cubic meters of low-carbon concrete. Taiwan Cement and other construction, electromechanical, and supply chain companies estimate that business opportunities for engineering, supply, and back-end packaging and testing could exceed NT$3 billion (US$98 million).

At its North America Technology Symposium in California on April 25, TSMC announced plans for a new section of the park, dubbed Fab 25, which will feature the four new chip fabs. The first fab is expected to enter mass production in the second half of 2028.