TAIPEI (Taiwan News) — Taiwan’s MediaTek and Alchip Technologies are among the first companies to adopt Nvidia’s latest chip connectivity solution, NVLink Fusion, unveiled Monday to accelerate the development of faster, more flexible computing systems.

NVLink Fusion enables chipmakers to connect their processors with Nvidia’s GPUs using the same high-speed interconnect technology that powers Nvidia’s own hardware. This marks a significant shift for the company, which has traditionally kept its advanced interconnect technology exclusive to its ecosystem, opening the door for outside semiconductor firms to build integrated, high-performance systems, according to Nvidia and Business Next.

This technology allows GPUs to operate as a unified, powerful system rather than as discrete components. Early adopters of NVLink Fusion include Taiwan’s MediaTek and Alchip, alongside Marvell, Astera Labs, Synopsys, and Cadence.

MediaTek, a global leader in integrated circuit design, played a key role in advancing this approach through its work with Nvidia on the compact AI supercomputer DGX Spark. DGX Spark integrates a MediaTek-designed CPU and an Nvidia GPU in a single package, according to UDN Money.

MediaTek CEO Rick Tsai (蔡力行) said the company aims to develop custom application-specific ICs that integrate Nvidia’s NVLink Fusion technology.

NVLink Fusion is a high-speed fabric architecture designed to enable efficient cooperation between multiple processors—whether CPUs, GPUs, or custom AI chips. To function seamlessly across different vendors’ chips, participants must ensure their designs meet NVLink Fusion’s requirements for data transfer, timing, power management, and packaging.

Alchip specializes in high-performance AI infrastructure application-specific ICs and custom chip design, offering design platforms for 2nm and 3nm chip technologies. According to the company, it provides expertise in creating AI accelerators and custom chips that can be physically and electrically integrated into NVLink Fusion-based systems.

Alchip’s experience with 2.5D and 3D chip stacking supports the complex multi-die systems NVLink Fusion enables. Its design flow addresses critical challenges such as power integrity, power grid architecture, data transfer across power domains, thermal management, simulation, and synchronization among individual chiplets or dies.