TAIPEI (Taiwan News) — M31 Technology announced Thursday that its eUSB2 intellectual property has achieved silicon-proven status on TSMC’s 3 nm process.

According to design software firm Cadance, eUSB2 was created to address power needs in small devices like phones and tablets. The specification is also backward compatible with USB 2.0.

Therefore, eUSB2 enables smaller, more power-efficient systems-on-a-chip, allowing process scaling while enhancing performance, per Anue.

M31 said in a press release that it first launched its eUSB2 specification on TSMC’s 7 nm platform in 2020. Since then, it has extended support to 5 nm, 3 nm, and now 2 nm, staying in step with the foundry’s advanced process roadmap, per CNA.

M31 Chang Yuen-hsun (張原熏) said the company has a long-standard partnership with TSMC, per Liberty Times. He added that the collaboration demonstrates the company’s strength in interface technology, helping clients adopt next-generation protocols and shorten chip development timelines.

The company said eUSB2 is widely used in flagship smartphone chips and AI-powered image processors. Looking ahead, M31 said it is fast-tracking its next-gen eUSB2 2.0 on 3 nm and 2 nm nodes.