TAIPEI (Taiwan News) — United Microelectronics Corporation announced Tuesday its new Singaporean wafer fab, with mass production expected next year.
UMC held an opening ceremony on Tuesday for its 22 nm fab at the Pasir Ris Wafer Fab Park in Singapore, per CNA. The grand opening was attended by top Singaporean officials, including Deputy Prime Minister Gan Kim Yong and Senior Minister Teo Chee Hean.
The first phase of the new facility will have a monthly production capacity of 30,000 wafers and is set to begin mass production in 2026, per a press release. UMC’s annual capacity in Singapore is expected to exceed 1 million wafers upon full operation.
The fab will manufacture chips using UMC’s advanced 22 nm and 28 nm processes, the most sophisticated foundry technologies currently available in Singapore, per a press release. These chips will support global customers, powering smartphone displays, Internet of Things memory, and next-generation connectivity solutions.
The expansion is expected to create 700 new jobs, including positions for process engineers, equipment specialists, and R&D experts UMC Co-President Chien Shan-chieh (簡山傑) said the new fab marks the next stage for the company.
“This fab expansion closely aligns with the Singapore government’s vision to become a leading advanced manufacturing hub, and we are deeply grateful for their support,” he added.
