TAIPEI (Taiwan News) — MediaTek announced its Genio 720 and Genio 520 AI chips at Embedded World in Nuremberg, Germany on March 11.

Powered by the company’s 8th-generation neural processing unit, the platforms offer up to 10 TOPS of AI acceleration, supporting transformer and convolutional neural network models, per a press release. They feature up to 16 GB of LPDDR5 memory, enabling the smooth operation of large language models such as Llama and Gemini for edge AI applications.

Built on a 6 nm process, the chips integrate an octa-core CPU with two Arm Cortex-A78 and six Cortex-A55 cores, balancing high performance and power efficiency. Their low-power design makes them ideal for fan-less enclosures and battery-powered devices, ensuring reliability across Internet of Things applications.

The platforms also provide extensive multimedia and connectivity options, including support for ultra-wide 4K/5K displays, dual 2.5K screens, and several camera configurations. They offer pre-integrated Wi-Fi 6/6E solutions, with support for Wi-Fi 7 and 5G RedCap via external modules, ensuring seamless connectivity for modern AI-powered IoT solutions.

The chips support open standard module (OSM) reference designs, which simplify product development and accelerate time-to-market for manufacturers. MediaTek said its partners plan to launch OSM-based solutions in the second half of this year.