TAIPEI (Taiwan News) — Taiwan is embracing international cooperation to uphold regional stability, President Lai Ching-te (賴清德) said at the eighth Yushan Forum, which opened on Monday.
Lai said he was committed to “working side by side” with other countries to address common challenges. Taiwan and its partners share the same goals, he said, adding that through global cooperation, “We hope to build an even more inclusive, resilient, and prosperous Indo-Pacific.”
Taiwan also seeks to bolster supply chains and its digital solidarity while defending democratic freedom and peace with like-minded nations, Lai said.
The president said Taiwan is establishing itself as a silicon and AI nation and developing capabilities in quantum technology and precision medicine. He envisioned Taiwan welcoming an era of smart technology, including in healthcare and transportation.
Lai said that the Yushan Forum is where participants can share experiences and lay the foundations for exchanges. “This way, we can create greater stability for the region and greater prosperity for the world.”
This year’s forum focuses on how Taiwan can strengthen its partnerships with the Indo-Pacific region and like-minded partners via its New Southbound Policy+, particularly in fostering cooperation between the public and private sectors. Guest speakers include former prime minister of Denmark and chair of the Alliance of Democracies Foundation Anders Fogh Rasmussen and Japan-ROC Diet Members' Consultative Council Chair Keiji Furuya.
As the Chinese military threat toward Taiwan continues to escalate, Lai is forming drone and chip supply chains independent from China with other democracies.
Defense Minister Wellington Koo (顧立雄) confirmed last week that Taiwan and the US are collaborating on civilian and military drones. Private sector firms and the National Chung-Shan Institute of Science and Technology have been working on developing related technologies, Koo said.
Earlier this month, TSMC announced it would invest NT$3.29 trillion (US$100 billion) to build three more chip fabs, two advanced packaging facilities, and an R&D center in Arizona.
