TAIPEI (Taiwan News) — Taiwan Semiconductor Manufacturing Company’s (TSMC) 1 nm process fab may be built in Tainan’s Shalun Smart Green Energy Science City, UDN reported Monday.

According to reports, the Giga-Fab, designated as Fab 25, will house six fabs. Industry sources say TSMC has submitted a land request to the Southern Taiwan Science Park Bureau for 1.4 nm and 1 nm chip production in Shalun.

The initial three fabs are planned for 1.4 nm production, while the latter three will produce 1 nm chips. The smaller the process, the more transistors can be packed into a given space, increasing computing performance.

Meanwhile, industry insiders say TSMC’s Arizona wafer Fab 21 Phase 1 has entered mass production this quarter, with a projected monthly capacity of 30,000 wafers by mid-year, per Commercial Times.

Sources say Phase 2 and Phase 3 construction is underway, with cleanroom and facility installations expected by 2025 and 2027, respectively. These facilities will introduce 2 nm production using nanosheet transistor technology.

Additionally, reports suggest TSMC is considering Texas for a chip packaging facility. Sources also say the company’s board of directors could hold a meeting in the US on Feb. 12.