TAIPEI (Taiwan News) —  Nvidia CEO Jensen Huang (黃仁勳) said Wednesday (Oct. 23) the company has worked with Taiwan Semiconductor Manufacturing Company (TSMC) to fix a design flaw in its Blackwell chips.

“We had a design flaw in Blackwell,” Huang said, per Reuters. “It was functional, but the design flaw caused the yield to be low. It was 100% Nvidia's fault.”

“What TSMC did, was to help us recover from that yield difficulty and resume the manufacturing of Blackwell at an incredible pace,” Huang added.

Media reports suggested the production delays had strained Nvidia’s relationship with TSMC, but Huang dismissed these claims as false news, per CNA.

Nvidia’s Blackwell B100 and B200 GPUs link their two chiplets using TSMC's CoWoS-L packaging technology, per Tom’s Hardware. A mismatch between chip components could cause the components to fail.