TAIPEI (Taiwan News) — Taiwan Semiconductor Manufacturing Co. (TSMC) may shift its new chip-on-wafer-on-substrate (CoWoS) plant selection from Yunlin to Pingtung, according to media reports.
The company said Wednesday (Sept. 25) that Taiwan remains its primary base, and plant location selection involves many considerations with “no possibilities excluded,” per CNA. The company added it would continue to work with the science park administrations to find suitable plant sites.
Meanwhile, TSMC said it plans to double its CoWoS advanced packaging capacity this year and double it again next year, aiming to reach a supply balance by 2025 or 2026. In August, the company spent NT$17.14 billion (US$537 million) to purchase Innolux’s factory and facilities in Southern Taiwan Science Park, which is speculated to be aimed at the advanced packaging sector.
TSMC has packaging and testing plants in Hsinchu Science Park and Southern Taiwan Science Park, per Liberty Times. Chiayi Science Park, covering approximately 20 hectares, is under construction and will house two of the company’s plants.