TAIPEI (Taiwan News) — Taiwan Semiconductor Manufacturing Corporation's (TSMC) Germany plant is set to hold a groundbreaking ceremony in Dresden on Tuesday (Aug. 20). 

TSMC Chair C. C. Wei (魏哲家) is reportedly leading a delegation to mark the company’s official expansion into Europe, CNA reported. TSMC said the European Semiconductor Manufacturing Company (ESMC) project is proceeding as planned. After the ceremony, site preparation will begin, and construction is expected to commence by the end of this year.

TSMC’s total investment in ESMC is expected to exceed €10 billion (NT$353 billion). The Taiwanese company holds a 70% stake in the project, while Bosch, Infineon, and NXP each have a 10% stake.

The German plant is expected to begin chip production by the end of 2027, utilizing TSMC’s 28/22nm complementary metal-oxide-semiconductor technology. It will have a monthly capacity of approximately 40,000 12-inch wafers.

Wei said TSMC will continue to expand its overseas semiconductor fabs. This includes projects in Arizona and Kumamoto and the new plant in Europe, demonstrating that TSMC's strategy remains unchanged.