TAIPEI (Taiwan News) — Taiwan Semiconductor Manufacturing Company (TSMC) has secured major orders from Qualcomm and MediaTek for its 3nm process.

To ensure the smooth launch of its Dimensity 9400 chip, MediaTek said it has started production at TSMC and is working hard to secure a stable supply of the necessary capacity, per UDN. The 3nm process is currently the most commercially advanced node.

MediaTek CEO Rick Tsai (蔡力行) announced at Computex on June 4 the Dimensity 9400 chip would be unveiled in Q4.

MediaTek’s current flagship Dimensity 9300/9300+ chips are built using TSMC’s 4nm process. With TSMC’s 3nm process, Dimensity 9400’s performance is anticipated to improve further.

Although Qualcomm has yet to reveal details of its new Snapdragon 8 Gen 4 flagship chip, it is believed that the chip will also be produced using TSMC’s 3nm process and will be released in Q4.

TSMC reported Wednesday (July 10) net revenue of NT$207.87 billion (US$6.39 billion) in June, per a press release.