TAIPEI (Taiwan News) — President of European Semiconductor Manufacturing Company (ESMC) Christian Koitzsch said on Monday (June 10) that its Dresen plant aims for mass production of chips in 2027.

Speaking at the Taiwan-EU Semiconductor Forum on Monday, the president said ESMC will recruit nearly 2,000 employees, targeting talent in Europe, per CNA. Koitzsch also reported that hundreds of Taiwan Semiconductor Manufacturing Company’s (TSMC) engineers will be stationed in Dresden over the next three to five years.

Koitzsch said the ESMC cleanroom will cover approximately 45,000 square meters. The scale of mass production will not only reduce production costs and enhance the competitiveness of wafer manufacturing but also create job opportunities within the supply chain, he said.

In terms of semiconductor technology exchange between Taiwan and Germany, Koitzsch said that to speed up the construction process, Taiwanese employees will be stationed in Dresden. Meanwhile, German employees will be sent to Taiwan for training to understand equipment maintenance and troubleshooting.

“This exchange will improve the future operational effectiveness of the German plant and help build a local semiconductor industry ecosystem,” Koitzsch said.

With the advancement of European Chips Act, Koitzsch said TSMC’s German plant will not only increase Europe's global semiconductor manufacturing market share but also produce about 480,000 12-inch wafers annually. Furthermore, TSMC plans to collaborate with academia, providing an environment and innovation platform for students to obtain semiconductor-related degrees, Koitzsch added.

ESMC is TSMC’s European subsidiary and is funded by TSMC, Robert Bosch GmbH, Infineon, and NXP.